The market is estimated at $ 4.2 billion in 2020 and is expected to reach $ 12.7 billion by 2026, with a CAGR of 20.5%

Dublin, November 08, 2021 (GLOBE NEWSWIRE) – The “3D TSV Devices – Global Market Trajectory and Analysis” report was added to offer.

The global 3D TSV device market, estimated at US $ 4.2 billion in 2020, is expected to reach a revised size of US $ 12.7 billion by 2026, with a CAGR of 20.5% over the period of ‘to analyse.

Memory, one of the segments analyzed in the report, is expected to grow at a CAGR of 19.9% ​​to $ 4.5 billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and the induced economic crisis, the growth of the Mems segment is readjusted to a revised CAGR of 21.6% for the next 7 year period. This segment currently represents a 22.2% share of the global 3D TSV device market.

Through-Silicon-Via (TSV) three-dimensional (3D) technology is steadily gaining image as a highly advanced semiconductor package design that dramatically improves chip performance and functionality.

Revolutionary System-in-Package (SiP) model, 3D TSV essentially focuses on fabricating interconnects to stack multiple dies, drilling through holes which are then filled with a conductive material such as copper, to fabricate Integrated chips (IC) with high performance. level performance and space efficiency attributes.

Driven by growing demand from global electronics manufacturers for innovative, high-performance chip architectures and designs in advanced packages with superior performance, power consumption, and form-factor functionality, 3D TSV technology has is making solid progress in the global semiconductor industry.

As trends in the global electronics industry continue to focus on advanced wafer packaging technologies such as 3D TSV technology, factors such as the expansion of the information technology sector and (ICT), the dramatic increase in the operations of Communication Service Providers (CSPs), the intensification of activity in corporate data centers and the growing proliferation of cloud computing services put the focus on TSV 3D.

Over the past few years, the global electronics industry has seen incremental advancements in all core segments including consumer electronics, automotive electronics, medical electronics, and defense electronics.

Asia-Pacific (including China and Japan) is spearheading the growth of the global 3D TSV market, led by countries like China, South Korea, Australia, Singapore and Indonesia which are key centers for the production of consumer electronics and automobiles. The increasing demand for silicon wafers in the production of smartphones and the implementation of 5G technology are particularly fueling the market growth in the region.

In 2019, a collective laser-assisted bonding process for 3D TSV integration using non-conductive paste (NCP) was developed in South Korea. This allows multiple TSV dies to be stacked simultaneously to improve productivity, while maintaining weld seam reliability using LAB (Laser Assisted Bonding) technology.

The growth of the Asian 3D TSV market is also driven by the increasing adoption of new memory technologies and the presence of key market players in the region. In Europe and North America, the increase in R&D activities related to the design of 3D integrated circuits is contributing to the growth of the market. The increase in 3D package with the use of TSV technology in the semiconductor industry is fueled by the demand to improve performance and reduce lead times.

In addition, the increasing use of TSV technology for functional integration as well as wafer fabrication and assembly in the semiconductor industry is driving the market growth. Europe is at the forefront in terms of 3D TSV technology, given the presence of various R&D companies. In Latin America, the 3D TSV market is benefiting from the growing demand for various electronic products. In the region, Brazil is a major market for cell phones, computers and other consumer electronics.

Main topics covered:




  • The impact of COVID-19 on the semiconductor industry exposes the risk of modularity of the value chain

  • Among the hammered companies in the supply chain is the ‘semiconductor industry’

  • Semiconductor trends for specific end-use categories

  • COVID-19 pandemic storm warrants new strategies to help semiconductor leaders breathe new life

  • Falling Consumer Confidence Impacts Auto and Consumer Electronics Sales

  • Industrial activity remains moderate in 2020

  • A prelude to 3D televisions

  • Comparison of TSV 3D with other 3D integrated circuit integration technologies: an overview

  • Global Market Outlook and Outlook

  • Regional analysis

  • Competitive scenario

  • Foundries stay ahead of the curve in 3D TSV device manufacturing

  • IDMs include 3D TSV technology in their platelet processing units

  • OSAT companies compete for a place in the 3D landscape of TSV

  • Benefits and Limitations for Foundries, IDMs, and OSATs Operating in a 3D TSV Landscape: An Overview

2. FOCUS ON CERTAIN PLAYERS (Total 68 featured)

  • Amkor Technology, Inc.

  • ASE Technology Holding, Co., Ltd.

  • Broadcom Ltd.

  • Intel company

  • Pure Storage, Inc.

  • Samsung Electronics Co., Ltd.

  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)

  • United Microelectronics Corporation


  • The 3D TSV device market heavily influenced by trends in the consumer electronics industry

  • Post-pandemic recovery in the CE sector to increase prospects

  • A review of key CE products leading to the adoption of 3D TSV technology

  • Smart phones

  • Tablet pc

  • Rising Trend of 3D Integrated Circuit Technology Increases Business Case

  • Rapidly evolving 3D IC technology to drive demand

  • Digital transformation to drive future growth of 3D TSV market

  • IoT ecosystem will increase opportunities for 3D TSV devices

  • AI hardware: new avenue of potential growth

  • Automotive electronization trends are expanding the addressable market

  • Post-COVID recovery predicted to reignite opportunities in the aerospace sector

  • High and sustained growth in the ICT sector bodes well

  • Continued proliferation of cloud-based applications to drive adoption of 3D TSV devices

  • Growing performance requirements of modern data centers to expand opportunities for 3D TSV devices

  • Data center traffic trends: a further review

  • 3D TSV Gains Ground in DRAM Industry

  • A review of next-generation TSV-based DRAM memory solutions

  • Mobile DRAM – LPDDR3 vs. Wide I / O

  • Growing market for MEMS to fuel market expansion

  • Portable devices to expand high quality opportunities

  • 3D TSV Devices Detect Big Opportunities in Vertical CMOS Image Sensors

  • CMOS Image Sensor (CIS) usage by sector and device / equipment

  • Imaging and optoelectronics: an important end-use segment for 3D TSV

  • 3D TSV sees growth in advanced LED packaging

  • WLCSP 3D: a mature TSV 3D segment

  • Bosch DRIE process gains importance in TSV implementation

  • System-level exploration and 3D floor planning technique improve performance of 3D IC devices

  • Demand for innovative databases and wireless routing is increasing market demand

  • Problems


  • An overview of the way through silicon (TSV)

  • An introduction to devices through silicon via (TSV)

  • Advantages of 3D TSV devices

  • Historical timeline




For more information on this report, visit

CONTACT: CONTACT: Laura Wood, Senior Press Manager [email protected] For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900

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